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Laboratory Solutions

PCB Approval for Use (Class 2 or Class 3)

Approval for use is laboratory verification to IPC-6012 for Qualification and Performance Specification for PCBs and IPC-A-600 Acceptability of PCBs, including Bare Board Electrical Test.

DIVaero performs an approval for use of the printed circuit boards before they are assembled. Once assembled, it is extremely difficult to determine if issues are the result of the bare board or the assembly process.

Board level evaluation may include (but is not limited to):

  • Microsectional analysis
  • Cross section for Copper thickness
  • Hole quality (Via hole and Component hole)
  • Thermal Stress and Solderability
  • Hot Oil De-lamination
  • Cleanliness testing
    • Modified Rose
    • Ion Chromatography available for specific Ion testing
  • Bare Board (electrical) testing to the IPC-D-356 Net List
    • 500V testing available for Specific applications such as Military.
  • DSC laminate evaluation for the Tg
  • XRF for the thickness of the surface finish (Gold, Nickel, Silver, Tin, HASL)

Cleanliness testing

  • Resistivity of Solvent Extract (ROSE) Testing
  • Ion Chromatography Test

Failure Analysis

Assembly Failure Analysis is based on a combination of X-Rays followed by microsectional analysis. Microsection is performed on the part and the solder connection to best view the metallurgical attachment and/or failure using successive grinds with measurements and pictures (Keyence 7000 microscope) at each grind depth. Then components are stressed and fractured to observe the failure mechanism. This tells if the solder joint is stronger than the attachment of the copper land to the PCB. Once the solder connection is stronger than the PCB pad adhesion, the joint is strong enough. If needed or requested by the customer, thermal shock may be used, which (again) is analyzed by microsection after the shock.

REFLOW ANALYSIS

Reflow analysis is based on the metallurgical bond that was achieved and the flow of the solder paste. For a BGA, the ball collapse and the attachment of the ball to the interposer board and the PCB are analyzed with a microsection. 3D X-Ray can perform a CT scan to determine the extent of the intermetallic formation.

Optional Testing Services available through DIVaero

  • Differential Scanning Calorimeter (DSC)
  • BGA / LGA Removal
  • BGA / LGA Replacement*
  • Hot Solder Delamination
  • Solderability Test For Plated Through Hole
  • Hot Solder Thermal Stress
  • Microsection (Cu Thickness, Hole Quality, Solder Flow In-Hole)
  • Environmental Chamber Thermal Hot/Cold
  • 3D X-Ray Inspection
  • X-Ray Flourescence (XRF) Surface Finish Measurement
  • Bare Board Test (Must Have PCB Netlist)
  • Visual Inspection To IPC Class 2 Or 3
  • PCB Drilling Or Routing Modifications

Reporting Options

For simplicity and cost, the basic report accompanying a Laboratory project will employ a combination of pictures and a basic explanation of the pictures. All data, including the pictures is in an attached Excel file.

If a formalized report is required, one is prepared with the report having excerpts from the Excel data for further clarification. The final report is in a MS Word format that is captured in a .PDF and written by DIVaero’s Sr. Technical Director.

Pricing

Contact DIVaero for a quotation.

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Indianapolis, IN
46268
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