Approval for use is laboratory verification to IPC-6012 for Qualification and Performance Specification for PCBs and IPC-A-600 Acceptability of PCBs, including Bare Board Electrical Test.
DIVaero performs an approval for use of the printed circuit boards before they are assembled. Once assembled, it is extremely difficult to determine if issues are the result of the bare board or the assembly process.
Board level evaluation may include (but is not limited to):
Assembly Failure Analysis is based on a combination of X-Rays followed by microsectional analysis. Microsection is performed on the part and the solder connection to best view the metallurgical attachment and/or failure using successive grinds with measurements and pictures (Keyence 7000 microscope) at each grind depth. Then components are stressed and fractured to observe the failure mechanism. This tells if the solder joint is stronger than the attachment of the copper land to the PCB. Once the solder connection is stronger than the PCB pad adhesion, the joint is strong enough. If needed or requested by the customer, thermal shock may be used, which (again) is analyzed by microsection after the shock.
Reflow analysis is based on the metallurgical bond that was achieved and the flow of the solder paste. For a BGA, the ball collapse and the attachment of the ball to the interposer board and the PCB are analyzed with a microsection. 3D X-Ray can perform a CT scan to determine the extent of the intermetallic formation.
For simplicity and cost, the basic report accompanying a Laboratory project will employ a combination of pictures and a basic explanation of the pictures. All data, including the pictures is in an attached Excel file.
If a formalized report is required, one is prepared with the report having excerpts from the Excel data for further clarification. The final report is in a MS Word format that is captured in a .PDF and written by DIVaero’s Sr. Technical Director.
Contact DIVaero for a quotation.